86exporter.com Home       Products Catalog      Suppliers Catalog      Log In        Sign up
      About Us
      Profile
      Products
      Contact Us


HONGXINTONG(HK)ELECTRONICS LIMITED

Products >> BGA Solderbump

BGA Solderbump

Build Your Online Product Catalogs?



Description
Product Name: BGA Solderbump
Supply Ability: 50000bottle
Related proudcts
Specifications BGA Solderbump(BGA焊锡球)
Price Term: FOB
Port of loading:
Minimum Order 1BOTTLE
Unit Price:

English introduction

The BGA tin ball(BGA tin bead) is to use to replace IC module pack structure in of lead feet, satisfy an electricity to connect with each other thus and machine conjunction request of a kind of conjunction piece.Its terminal product is a digital camera|MP 3| MPs are 4| notebooks|move a correspondence equipments(cellular phone, Gao repeatedly corresponds by letter an equipments)|LED|LCD|DVD|calculator mother board|PDA|the car carries a LCD TV|family cinema(AC3 system)|satellite fixed position system etc. the consumption electronics product.BGA|CSP the development that pack a piece adjusted the trend of technique development and satisfied people short, small, light to electronics product, thinly request this is that a kind of high definition surface assemble pack a technique and return to fix a Taiwan, bga to pack to the bga, the bga return to fix, BGA plant a ball request all very high.At seal something to pack

Composition and characteristics
(Composition and characteristics)

(alloying component) (Melting Point)(C)



Sn63/Pb37 183 183

Sn62/Pb37/Ag2 179 179

Sn99.3/Cu0.4 227 227

Sn96.5/Ag3.5 221 221

Sn96/Ag4 221 232

Sn96.5/Ag3/Cu0.5 217 219



Silver electrode welding components

Commonly used solder

Lead-free soldering



Diameter(mm) Tolerance(mm) out of roughness(mm) Tablets / bottle G / bottle(Net Weight)

0.25 土0.010 < 0.008 100ten thousand grain 68.92g

0.30 土0.010 < 0.010 100ten thousand grain 119.05g

0.35 土0.010 < 0.010 100ten thousand grain 189.02 g

0.40 土0.012 < 0.011 50ten thousand grain 141.50 g

0.45 土0.012 < 0.012 50ten thousand grain 20



HONGXINTONG(HK)Ele

Contact Us
Company: HONGXINTONG(HK)ELECTRONICS LIMITED
Contact: Mr. CAI MR.CAI
Address: Huaqiang, Futian District, Nanjing-based Building a Room 20E, Block A
Postcode: 518000
Tel: 86-0755-83323191
Fax: 86-0755-22647582
E-mail:         


Copyright© HONGXINTONG(HK)ELECTRONICS LIMITED All Rights Reserved.
Tel : 86-0755-83323191 Fax : 86-0755-22647582
Powered by 86exporter.com