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Product Name: |
BGA Solderbump
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Supply Ability: |
50000bottle |
Related proudcts |
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Specifications |
BGA Solderbump(BGA焊锡球) |
Price Term: |
FOB |
Port of loading: |
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Minimum Order |
1BOTTLE |
Unit Price: |
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English introduction
The BGA tin ball(BGA tin bead) is to use to replace IC module pack structure in of lead feet, satisfy an electricity to connect with each other thus and machine conjunction request of a kind of conjunction piece.Its terminal product is a digital camera|MP 3| MPs are 4| notebooks|move a correspondence equipments(cellular phone, Gao repeatedly corresponds by letter an equipments)|LED|LCD|DVD|calculator mother board|PDA|the car carries a LCD TV|family cinema(AC3 system)|satellite fixed position system etc. the consumption electronics product.BGA|CSP the development that pack a piece adjusted the trend of technique development and satisfied people short, small, light to electronics product, thinly request this is that a kind of high definition surface assemble pack a technique and return to fix a Taiwan, bga to pack to the bga, the bga return to fix, BGA plant a ball request all very high.At seal something to pack
Composition and characteristics (Composition and characteristics)
(alloying component) (Melting Point)(C)
Sn63/Pb37 183 183
Sn62/Pb37/Ag2 179 179
Sn99.3/Cu0.4 227 227
Sn96.5/Ag3.5 221 221
Sn96/Ag4 221 232
Sn96.5/Ag3/Cu0.5 217 219
Silver electrode welding components
Commonly used solder
Lead-free soldering
Diameter(mm) Tolerance(mm) out of roughness(mm) Tablets / bottle G / bottle(Net Weight)
0.25 土0.010 < 0.008 100ten thousand grain 68.92g
0.30 土0.010 < 0.010 100ten thousand grain 119.05g
0.35 土0.010 < 0.010 100ten thousand grain 189.02 g
0.40 土0.012 < 0.011 50ten thousand grain 141.50 g
0.45 土0.012 < 0.012 50ten thousand grain 20
HONGXINTONG(HK)Ele |
Company: |
HONGXINTONG(HK)ELECTRONICS LIMITED
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Contact: |
Mr. CAI MR.CAI |
Address: |
Huaqiang, Futian District, Nanjing-based Building a Room 20E, Block A |
Postcode: |
518000 |
Tel: |
86-0755-83323191 |
Fax: |
86-0755-22647582 |
E-mail: |
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